TOKYO – AGC plans to open a new facility in Japan to expand production capacity for its novel fluorinated resin for high-speed circuit boards.

AGC will set up a new supply framework for its Fluon+ EA-2000 product at its Chiba plant. Operations are scheduled to begin September 2019, with operation of 5G material production lines expected to begin around 2020.

The material is primarily used in laminates for 5G high-speed, high-frequency PCBs.

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