SAN JOSE -- Atmel has released a 17-page document detailing application guidelines for successful mounting of the company's surface mount packages.

The application notes cover land patterns by package family, thermal vias, stencil design, solder reflow, component standoff heights and a variety of other guidelines for QFN, TSSOP, BGA, WLSCP, QFP and DFN packages.

Click here to download the pdf: http://www.atmel.com/images/atmel-8826-seeprom-pcb-mounting-guidelines-surface-mount-packages-applicationnote.pdf.