BANNOCKBURN, IL – IPC has released the C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.

It is a tool to help improve reliability of ball grid arrays and fine-pitch ball grid arrays in high-density applications.

IPC-7095C addresses design and process considerations of particular importance to portable handheld products in which BGAs are a dominant interconnection technology.

The revised document now includes expanded information on mechanical failure issues such as PCB pad cratering or laminate defects that occur after assembly. In addition to providing guidelines for BGA inspection and repair, IPC-7095C addresses reliability issues and the use of Pb-free joint criteria associated with BGAs.

It also features photographs of x-ray and endoscope illustrations to identify various defect conditions such as head-in-pillow.

For more information, visit www.ipc.org/7095.