BOSTON – ANSYS and subsidiary Apache Design will host a complimentary seminar series featuring its simulation software platforms and methodologies for low-power mobile, high-performance computing, consumer and automotive electronics.

Dimensions of Electronic Design will take place Oct. 11 in Boston; Oct. 18 in Santa Clara, CA; Oct. 24 in Los Angeles, and Nov. 1 in Austin, TX.

Technical tracks include 20nm Low-Power IC Design; Signal Integrity and Chip-Package-System, and Antennas and RF.

The seminar will provide technology updates on ANSYS HFSS, Apache RedHawk, ANSYS SIwave, and more. Attendees will see the latest advancements in high-performance computing for simulation speed and capacity, as well as hear designers share experiences meeting power, performance and price targets for their most advanced electronic designs.

To register, visit http://www.cvent.com/events/ansys-seminar-dimensions-of-electronic-design/event-summary-3908ddec871949fcb6bc65ec623883e4.aspx.