DARMSTADT, GERMANY -- To address customer demand for integrated layout and 3D full wave analysis, Computer Simulation Technology has undertaken a major collaborative project to enable layout engineers to stay within the Cadence environment while performing a full wave 3D extraction and EM analysis in the background.

Results are back annotated to the Cadence environment. This EDA centric viewpoint is said to simplify the workflow required to achieve design goals.

CST has offered a plug-in to Cadence tools for some years and more recently a direct import has become available that offers component recognition, layer editing and net and area selection. The latest effort was a collaboration between the two companies to simplify and integrate the workflow.

A webcast on June 23 will demonstrate the integration.

“Simplifying the workflow for layout design and analysis will bring big benefits to the engineer working to get his designs accepted,” said Martin Timm, director of marketing, CST. “Not having to learn a new environment or pass the design on to another department will save time and increase overall throughput significantly.”

"With increasing numbers of complex, multi-die packages being designed that run at GHz frequencies, package designers now require 3D full wave extraction of IC package structures,” said Brad Griffin, product management director, SiP and IC Packaging at Cadence. “The seamless integration of CST's proven 3D full wave extraction engine with the Cadence SiP Signal and Power Integrity solution, unites two recognized leaders into a simplified IC package design flow.”

More information on and webcast registration for "Integrated 3D Full-Wave Analysis of Mixed Signal 3D Packages" can be found here: http://www.secure-register.net/flyer.php?id=1127