LISLE, IL – Molex Inc. has released a white paper for design engineers, product technicians and processing operators interested in using its Solder Charge technology, a new SMT concept.

Innovations in SMT have become critical as component density in PCB assemblies continues to increase. Molex’s Solder Charge technology is said to improve compliancy, increase yields and reduce solder-joint stress, while improving fatigue strength. It is reported to provide bonds that are three times stronger than traditional BGA technology.

Some of the areas of expertise the white paper covers include: grass roots design and research; proof of concept studies and expert validation; and reliability testing.

“The goal of this white paper is to lay out the many considerations of developing a new solder attach process,” says Adam Stanczak, product manager. “The new technology must be thoroughly examined –from concept to completion– so that it can easily and effectively be integrated into the current manufacturing process.”

Stanczak and Kirk Peloza, senior design engineer, will present the paper at the SMTA International Electronics Exhibition tomorrow.