EAST WALPOLE, MA – Hollingsworth & Vose introduces ViaMat, nonwoven aramid paper. It is reported to improve dimensional stability and to enable higher interconnect densities in electronic packaging applications.
 
The fibers are randomly aligned, creating an isotropic nonwoven paper that allows for uniform density and resin pickup. A low CTE provides dimensional stability, and the surface smoothness allows uniform resin application.
 
Saturation of the product can be processed on most existing glass resin saturation lines with minimal cost. Interconnect density is increased over industry standard woven materials because of the product’s laser/plasma ablation and drill ability.