CoolitPCB v4.0 Offers Thermal Options

Published: 13 October 2008
 by Staff
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HANOVER, NH– Daat Research Corporation introduces CoolitPCB v4.0, the cost-effective, easy-to-use CFD software that provides a thermal modeling option. PCB designers can perform board level analysis; predict thermal behavior of designs and pinpoint optimum component placement on boards.
 
The software allows designers to construct models of Ball Grid Arrays, Dual Inline Packages and Quad Flat Packages in detail. They can also select, modify and save IC packages from the extensive IC Package Library, saving the results. The models can be converted into compact models, allowing for rapid computation and saving valuable time.
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