BOSTON -- A pair of leading experts on printed circuit board design have released a new book exploring the temperature of traces and vias and how accommodate them in a design.

PCB Design Guide to Via and Trace Currents and Temperatures covers PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces. It details the curves found in IPC-2152, the equations that fit those curves and computer simulations that fit those curves and equations. The 246-page book, authored by Doug Brooks, Ph.D., and Johannes Adam, Ph.D., presents sensitivity analyses that show what happens when environments are varied, including adjacent traces and planes, changing trace lengths, and thermal gradients; and explores via temperatures and what determines them, along with fusing issues and whether we can predict the fusing time of traces. Readers will learn how to measure the thermal conductivity of dielectrics and how to measure the resistivity of copper traces and why many prior attempts to do so have been doomed to failure.

To order:

For customers in the US, Canada, South America, Australia, New Zealand: Call: 1-800-225-9977 (in the US or Canada), or 781-769-9750, ext. 4030

Fax: 1-781-769-6334

Email: This email address is being protected from spambots. You need JavaScript enabled to view it.

Customers in the UK, EMEA, Asia, or international orders:

Call: +44 (0)20 7596-8750

Fax: +44 (0)20 7630-0166

Email: This email address is being protected from spambots. You need JavaScript enabled to view it. The book in on sale at a 25% discount through the end of March. Promo code: PCB25

See Brooks' and Adam's work in this area here:

• "Stop Thinking about Current Density and Via Temperature"
• "More on Via Temperatures"