SAN JOSE –– The Multi-Die Integrated Circuit (IC) Design Guide has been updated with the latest background on multi-die integration techniques and technologies.

Version 2016.6 of the 500-page design guide also includes information provided by vendors that offer multi-die IC design and manufacturing solutions and services.

The document was edited by Herb Reiter of eda 2 asic and was released by the Electronic System Design (ESD) Alliance, formerly the EDA Consortium. It is available as a free download from esd-alliance.org.

“As the organization focused on serving the electronic system design ecosystem, we are taking an active role to bring together the design and manufacturing communities,” said Bob Smith, executive director of the ESD Alliance. “To that end, we’re working with Herb Reiter to publish the design guide and form the System Scaling Working Group within the Alliance.”