M-Speed is a chemical process supporting fabrication of high-frequency printed circuit boards. Provides low-profile innerlayer copper; delivers strong adhesion to all high-speed dielectrics. Chemicals offer cleaning, etching, and copper surface modification for optimal innerlayer bonding. Provide low-profile surface topography. Copper-to-resin adhesion and thermal resistance reportedly exceeds alternative chemical processes.

MacDermid Electronics Solutions, www.macdermid.com