CupraEtch SR surface pretreatment is said to maximize adhesion of dry and liquid soldermasks and photoresists. Sustainable and robust copper treatment; can also be used for photoresist pretreatment for innerlayers and outerlayers by employing a lower etch depth. Low-temperature, three-step-process is based on cupric chloride etch. Is suitable for tenting, pattern plating and conveyorized application of thin material handling. Is compatible with multiple copper types, a variety of soldermasks, and selective finishes such as ImSn (immersion tin) and ENIG (electroless nickel immersion gold). Copper loading capacity of up to 40g/L, for reduced feed and bleed needs.

Atotech, www.atotech.com