µFlex Series multi-axis precision laser micromachining platform, Is  configurable to accommodate a variety of laser wavelengths, powers, and pulse widths, from nanosecond to femtosecond, to optimize processes for a broad spectrum of materials. Novel real-time control system synchronizes timing of laser pulses with laser beam positioning and movement of work surface. Footprint is as small as 1.7 sq. m. Accepts a range of industry-standard automation technologies for loading and unloading parts. Options for ultraviolet, infrared, CO2 and green lasers. For laser drilling applications in consumer electronics, medical devices, automotive components, and other industries.

ESI, http://www.esimicroflex.com