FlexVIA-Plus delivers single-stage plasma processing - including etchback and desmear -- of up to 30 panels (panel size 500 x 813mm/ 20 x 32") per cycle, enabling a rate of as much as 200 units per hour. For manufacturing flexible PCBs. Horizontal electrode design, with integrated rack, provides optimum material alignment. Versatile horizontal racks for processing of various flexible PCB sizes and make loading easy. Small footprint. Descum effectively removes resist residue from innerlayers and panels and residual solder mask bleed for better bonding and solderability. Features temperature-controlled electrodes for process repeatability.

Nordson March, www.nordsonmarch.com