Sarcon 25GR-T2d thermal interface material is conformable gap filler pad with a reinforced mesh center. Is for applications that require a thermal interface bridge across larger surface areas. Is reportedly an alternative to thin films when it is not possible to exert a large amount of force between the heat spreader, housing, PCB and heat sink. Is 0.25mm thick; delivers a thermal conductivity of 1.5 W/m°K and a thermal resistance of 0.40°Cin²/W at 43.5 psi. Is recommended for applications with operational temperatures between -40°C and +150°C. Can be ordered in 10m rolls or pre-cut sheets up to a max size of 200mm x 300mm.

Fujipoly America Corp., http://www.fujipoly.com