PallaBond direct palladium surface finish process, with optional gold layer, permits direct deposition of palladium on copper, without using nickel. Is suitable for key press, high-frequency, flexible PCB gold, aluminum and copper wire-bonding applications. Is said to provide superior solder joint strength for lead-free and eutectic SnPb solder and is compatible with many new base materials and soldermask types. Operates at a thickness of less than 300nm, for fine lines and spaces. Is free of thiourea, lead and nickel.

Atotech, www.atotech.com