Duraposit SMT-810 electroless nickel solderable final finish is said to have longer bath life and improved deposit uniformity. For use with Aurolectroless SMT 520 immersion gold. Features corrosion resistance and solderability which is maintained at both high and low bath loading and throughout the solution life. Self-adjusting pH simplifies bath operation. Fine Ni grain deposits around annular ring and pad corner, for gold adhesion and to reduce gold peel-off. Lower Ni content make-up at Ni 5g/L can reduce waste water discharge.

Dow Electronic Materials, http://www.dowelectronicmaterials.com/products/printed_circuit_boards/hdi/duraposit-smt_810.htm