Sarcon GR25A-00-50GY soft thermal gap filler pad exhibits low thermal resistance. Is a thermally conductive silicone-based material that reportedly conforms to most component shapes and board protrusions. Exhibits low pressure. This 0.5mm thick TIM provides a thermal conductivity of 2.5 W/m°K and a thermal resistance as low as 0.18 °Cin²/W. Is available in pre-cut sheets up to a max. size of 200 x 300mm; can be die cut to application specifications.

Fujipoly America Corp., www.fujipoly.com