RO4360G2 laminates reportedly have improved thermal reliability for higher UL max. operating temperatures. Have higher Dk of 6.15 @10GHz. Reportedly permit a 20-30% reduction in printed circuit board size. Reportedly process similar to FR-4 and are automated assembly compatible. UL 94V-0 flame rating pending; Pb-free process capable. Thermal conductivity is 0.81 W/m/K, Z-axis CTE is low, and drill performance similar to RO4350B.

Rogers Corp., www.rogerscorp.com