MCL-E-800G/MCL-E-705G series semiconductor package substrate materials are halogen-free, high Tg, low thermal expansion. 800G series has a CTE of 2.8ppm/℃, and is for use in package-o-package (PoP) and FC-BGA interposer substrates. MCL-E-705G series is suitable for multi-tiered structures such as stacked semiconductor packages.

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