Miniature SMT Test Point features symmetrical flat-wire design to test printed circuit boards. This “Mini-pad” version enables high-strength test point-to-PCB bonding. Accepts a variety of gripping probes to replace wire-wrap posts and turret terminals. Reportedly is ideal for testing circuitry of high-density PCB packages. Is manufactured from phosphor bronze and silver plate; can accommodate Pb-free solder and traditional reflow processing. Packaging is on tape and reel.

Keystone Electronics, www.keyelco.com