HyperLynx 8.2 suite of analysis tools offers new functionality for printed circuit board designs, including 3D full-wave field solving and integrated thermal/power co-simulation analysis capabilities. Integrates HyperLynx Thermal analysis with HyperLynx PI (power integrity) products to calculate effects of heat generated by areas of high current density in power distribution networks on the PCB. Analysis performed with 3D full-wave models for structures such as vias, and with 2D/2.5D solutions for constructs such as traces. HyperLynx PI now includes co-simulation between power integrity DC and thermal analysis to reflect the combination of heating of PDNs and heat dissipation from components, and increased copper resistivity due to this heating.

Mentor Graphics, www.mentor.com