92ML thermally conductive multilayer epoxy laminate and prepreg is ceramic-filled. Has a thermal conductivity of 2 W/mK for multilayer PWBs for applications requiring thermal management throughout the entire board volume. Reduces hot-spots and dependence on thermal vias and heat-sinks; has glass transition temperature of 170°C for plated through-hole reliability, Pb-free solder application. Has decomposition temperature >350°C, ideally suited for Pb-free solder processing. Has electrical strength of >1000 V/mil for use in high-power handling.

Arlon, www.arlon-med.com