RollVIA self-contained vacuum plasma system features roll-to-roll material handling for printed circuit board manufacturing environments.

Incorporates vacuum and gas flow technology, new electrode designs, and temperature management, with control of roll speed, tension, and edge guidance for uniform plasma treatment in surface activation, desmear, and etchback applications of substrates as thin as 25 µm. Has 40 kHz power supply and a 2030 x 2032 x 2428mm footprint with an integrated pump package. Is available in three models; accommodates web widths up to 500mm.

Nordson March, http://www.nordson.com/en-us/divisions/march/pages/default.aspx