Ledia 5 direct imaging system for printed circuit boards uses a multi-wavelength UV LED. Offers flexible imaging capable of handling any photosensitive material (photo resist). Has newly designed autoloader. Exposes circuit patterns at high-speed and precision onto photo resist and solder resist films on PCB. Eliminates photo mask-related processes from conventional exposure. Handles a wide range of production formats, from small run production of test PCB for diverse products through to mass production. Exposure over a range of wavelengths from 350 to 420nm is possible. Uses a 2-D modulator projection imaging system; performs modulated imaging while synchronizing with transfer stage. Has high-precision imaging head.

DaiNippon Screen Mfg. Co. Ltd., www.dnse.com