The QFN package design kit for Agilent’s Advanced Design System electronic design automation software is based on MicroLeadFrame packages. Enables mutual Amkor and Agilent customers to improve RFIC/MMIC design quality and time-to-market. Can explore various design specifications with package information and implement optimized RFIC/MMIC designs. Contains models for 3 x 3, 4 x 4, 5 x 5, and 6 x 6 MLF QFNs. All die are scalable; material properties can be modified. Includes scalable models for bond pad arrays and board via arrays.

Amkor, www.amkor.com