XT/duroid thermoplastic laminate materials are for high-frequency multilayer circuits. Feature thin halogen-free dielectrics and come with low-profile copper foil cladding bonded directly to the dielectric without the use of adhesives, for low insertion loss. Are flame-retardant and thermally and chemically robust with high melting points and low outgassing. Feature a z-axis Dk of 3.23 ±0.05 at 10 GHz and a dissipation factor of 0.0035 or less at 10 GHz. Thermal coefficient of dielectric constant (TCK) is +7 ppm/°C from -50° to +150°C. They also exhibit excellent thermal conductivity of 0.35 W/m/°K. Estimated maximum operating temperature exceeds 210°C. Are compatible with lead-free-solder assembly methods.

Rogers, www.rogerscorp.com