RT/duroid 6035HTC high-thermal-conductivity laminate is for low loss in high-power circuits. Fluoropolymer composite material is for RF and microwave applications. Features relative Dk of 3.5 at 10 GHz, thermal conductivity of 1.44 W/mK and loss tangent of 0.0013 at 10 GHz. Is said to have superior heat-transfer characteristics. Fabricated with thermally stable, reverse-treated and electrodeposited copper foils. Supports clean drill holes with minimal tool wear. Available in a variety of dielectric thicknesses and cladding options.

Rogers Corp., www.rogerscorp.com