SinkPAD technology for aluminum IMS PCB improves LED thermal management; is for high-power and high-bright surface mount LED systems that can't efficiently dissipate heat. Conducts heat from LED system by enabling a direct thermal path between the LED and surrounding atmosphere; eliminates thermal resistance introduced by dielectric material in a traditional IMS PCB or MCPCB. Reportedly removes the substance with the lowest thermal conductivity/highest thermal resistance from the structure. Isolates dielectric’s metal base electrically and leaves it thermally connected.

SinkPAD, www.sinkpad.com