3D EXT analysis tool is reportedly capable of full wave parasitic extraction of hundreds or thousands of interconnects simultaneously. Supports all types of interconnects, including wire bond, column grid and via arrays, and through silicon vias (TSVs) used in ICs and silicon interposers. Output is standard Touchstone file or RLGC information that can be directly input to Sphinx for Signoff for frequency simulation or converted to Spice with Idem Plus for simulation in any customer preferred spice timing based simulator.

E-System Design, www.e-systemdesign.com