Pyralux TK flexible circuit material is a copper-clad laminate and bonding film specifically formulated with Teflon fluoropolymer film and Kapton polyimide film for high-speed digital and high-frequency applications. Contains no glass. Dk is 2.3 to 2.7; Df is 0.002 or 0.003, depending on the film construction. Is designed for high-speed flex applications, including microstrip and stripline-controlled impedance constructions. A variety of copper foil weights are available: standard foils are 18 and 35 µm rolled annealed copper. Is a layered dielectric. Teflon is also available separately as a sheet adhesive. Comes in laminate thicknesses of 50, 75 and 100 µm. Bondply thicknesses are available in 75 or 100 µm.

DuPont Circuit and Packaging Materials, www.DuPont.com