Presa RMK-30 immersion tin for PWG/ PKG produces thick deposit and mitigates tin whiskers.  Compatible with virtually all commercial solder masks; usable in vertical or horizontal equipment. Deposits via displacement on copper surface. Tin deposit said to maintain excellent solderability, even with higher temperatures and following long storage. Fluoride-free bath operates at relatively low temperatures; delivers consistent performance throughout long service life. Compatible with eutectic and Pb-free solder; meets requirements of press fit connections.

Uyemura Intl. Corp., www.uyemura.com