PowerDC Thermal software works in concert with the PowerDC Electrical simulation software as an integrated thermal/electrical analysis environment for IC packages and printed circuit boards. Is said to eliminate manual iterations between simulations with separate electrical and thermal tools, reduce time and improve results convergence. Considers both die heating and copper heating on package and board, and takes into account temperature and location dependencies. Considers factors such as increasing electrical resistance at higher operating temperatures. Results are said to accurately reflect the impact of increasing component power dissipation as temperatures rise. Imports design files from all popular PCB and IC package layout systems. Performs analysis on partially or fully placed and routed designs. Account for complex plane shapes, including cut-outs, wires, solder balls, solder bumps, and via structures to maximize accuracy.

Sigrity Inc., www.sigrity.com