Technistan Ag high speed tin-silver alloy electroplating process for use in electronic connector and component applications. Is said to produce a SnAg5 bright electrodeposit at current densities of up to 300 ASF / 30 ASD. Is also capable of producing other SnAg alloy compositions, depending on application. For semiconductor components, connectors and other applications.

Technic, www.technic.com