Rogers Corp. introduces RO4730 LoPro laminates for base station, RFID and other antenna designs. The halogen-free laminate combines low-loss dielectric with low-profile copper foil for reduced passive intermodulation and low insertion loss.
 
The thermoset resin system incorporates a hollow, microsphere filler, producing a low density, which results in a lightweight laminate that is reported to be 30% lighter than woven-glass PTFE materials.
 
According to the company, the product has a matched dielectric constant of 3.0. It is also lead-free and automated assembly compatible.
 
Features include low z-axis CTE of about 40 PPM/°C and a temperature coefficient of dielectric constant of around 23 PPM/°C. The RO4730T LoPro has a high glass transition temperature greater than 280 °C, the same as the company’s other RO4000 laminates, and is compatible with standard PCB fabrication techniques and PTH processing.
 
www.rogerscorp.com