Fujipoly introduces GR-H and XR-H, gap fillers. The thermal interface materials have a unique hardened top surface. The company reports that the thermal pad adheres to the electrical component or opposing heat sink and can easily release during disassembly for re-work or repair, preventing damage and tearing.
 
The products are available in eight formulations, offering thermal conductivity from 1.2 W/m°K to 17.0 W/m°K. Thicknesses range from 0.5 mm to 5.0 mm, with a maximum dimension of 200 mm by 300 mm. The material easily conforms to uneven components and makes a complete thermal transfer contact.
 
www.fujipoly.com
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