Würth Elektronik introduces Lasercavity that combines laser machining technology and thermo-compression bonding to integrate active components into PCB innerlayers. The technique uses lasers to generate a cavity in the innerlayer where a flip chip can then be incorporated using thermo-compression bonding techniques.

 A laser cavity of up to 300 µm is carved out in the PCB innerlayer. Laser technology provides high precision for both the cavity dimension and depth. The cavity is then coated with an adhesive. The flip chip is placed by a die bonder and the adhesive is cured under pressure. The chip stud bump connections are also soldered at the same time.

Process creator, Roland Schönholz, product manager HDI-microvia at Würth Elektronik said the Lasercavity process is exciting because of its simplicity and efficiency.

Reliability testing of Lasercavity-PCBs has been conducted. In the testing, that used thermal shock and long-time temperature exposure, the bonding joint between the PCB and the flip chip demonstrated high reliability.  

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