Pyralux APR Embedded Resistor Laminate
Published: 05 February 2009
DuPont introduces Pyralux APR copper clad resistor laminate. The product is a double-sided construction of polyimide film bonded to copper foil and used in advanced multi-layer flex, rigid flex and rigid PCBs. It features Ticer Technologies TCR thin film copper resistor foil as one or both of the clad foils.
Available in a range of dielectric thicknesses and resistance levels, the laminate provides a variety of circuit constructions. It is compatible with printed wiring board processes and has a thermal resistance up to 180° C.
Having embedded capacitance and resistance, the product is reported to have excellent dielectric thickness tolerance and electrical performance. It is also IPC 4204/11 certified.
www.pyralux.dupont.com
