Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.
 
It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.
 
It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.
 
www.arieselec.com