Advanced Interconnections Corporation introduces a compact socket adapter system. The hybrid design utilizes both male and female pins in an interstitial pattern, in 0.65 mm-pitch BGA and LGA footprints.
 
Designed for development and validation of BGA and LGA devices, production level socketing and SMT board-to-board connector applications, the system is 2.00 mm larger than the device package. No external hold-downs are necessary.
 
The adapter offers signal attenuation up to 3.5 GHz, and unique alignment pins assist in hand placement and protect the pin field. Optional stand-offs are available. Features include standard eutectic tin/lead solder balls or lead-free tin/silver/copper solder ball terminals for RoHS-compliant applications.
 
www.advanced.com