Integrated Module Board technology permits smaller boards through adaptations to existing manufacturing processes. Components are embedded inside the core layer of the PCB, while being electrically connected directly to the conductors on top of the core layer. Can embed many types of components, including passives, bare die and wafer-level CSPs. Combines PCB manufacturing, component packaging and component assembly into one manufacturing sequence. Can be used to embed components inside a module substrate and manufacture a multi-chip-module / System-In-Package (SIP) product. Can be used to embed components inside a motherboard to manufacture a System-In-Board (SIB) product.