Fujipoly America Corp. introduces a thermal interface material, Sarcon® GR-c material that reduces EMI emissions. The material exhibits 20dB of shielding effectiveness between 10MHz and 1GHz. It provides thermal conductivity of 1.2 W/m°K. The company claims the material maintains a low thermal resistance that ranges between 1.24 and 3.27 °Cin²/W depending on the thickness used. For use between electronic components and nearby heatsinks, the material conforms to fill facilitating thermal transfer.  This gap filler formulation is available in sheets with thicknesses from 1.0 mm to 3.0 mm up to a maximum 200 mm x 300 mm dimension.

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