Uyemura Announces EVF Micro Via Electroplate
Published: 01 February 2008
Uyemura announces its EVF micro via fill acid copper electroplate used for PCB stacking technologies. The company claims exceptionally stable organic additives which can plate vias from 50 - 200 microns, with low surface thickness and minimum “Dimple,” and can fill vias at 20 ASF in less than 90 minutes.
www.uyemura.com
