CN33-802 silver-based conductor paste is designed for feed through-hole applications; CN33-803 is a plateable silver termination conductor for dipping processes; CN34-803 (3:1 palladium/silver) and CN34-820 (20:1 palladium/silver) provide initial and aged adhesion properties; CN37-802 platinum/palladium/silver offers solder leach and silver migration resistance. All conductors are said to be solderable.
Sumitomo resistor pastes are Pb- and cadmium-free. Are for hybrid IC applications. Sumitomo Metal Mining’s RG-A series of Pb- and cadmium-free resistor thick film pastes are reportedly for environmentally friendly chip resistors. Are available in resistances from 0.1 ohm/sq. to 10 Mohm/sq.; are said to exhibit the same electrical characteristics as SMMR-U pastes. Have a fired thickness of 6 to 9 µm and are said to be suitable for hybrid IC, resistor networks, and other applications.