LPKF MicroLine UV 300 Speeds Up Cutting Flex PCBs, Cover Films

Published: 22 May 2007
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GARBSEN, Germany – LPKF’s MicroLine UV 3000 laser cutting system represents the next generation of LPKF's successful MicroLine 350Di, addressing critical applications in prototyping and pre-series production.

The MicroLine UV 3000 laser cutting system includes a new laser source and a new high-speed linear drive, reportedly featuring greater positioning accuracy, higher speed and faster acceleration – resulting in slashed processing times. The new re-designed vacuum table is said to make the loading and unloading process quick and easy.

The LPKF MicroLine UV laser system encompasses versatile tools with the ability to perform precision cutting, routing, skiving, drilling, cutting pockets, structuring of etch/solder resist, micromachining of ceramic substrates and more.

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