Printed Circuit Design & Fab Online Magazine - March Plasma Improves Throughput of PCB Plasma Treatment System

CONCORD, CA – March Plasma Systems has released an improved PCB panel pre-etch conditioning technology. With it, the company's PCB series products can reportedly increase the throughput in applications such as desmear and etchback. It is said that productivity improvements of more than 30% can be achieved with this new system enhancement. The new product feature will be implemented on all new PCB series shipments, and is also available for retrofit on existing systems.

The typical three plasma process steps required for high uniformity treatment in desmear and etchback applications include a pre-etch segment, a desmear or etchback segment, and a residual reactant removal segment. The PCB panel pre-etch segment is required to ensure controlled etch across each panel within an individual processing cell as well as from processing cell to processing cell. The new pre-etch conditioning technology reportedly reduces this segment's time by more than 65%, resulting in improved PCB system throughput.

“March has always been a technology-driven company and this latest innovation adds to our list of continuous improvement to our PCB product platform,” said James Getty, director of Applications Engineering at March Plasma Systems. “Our technology gives us a competitive edge in the marketplace with our advanced plasma processing equipment. We are confident that this new technology addition will find rapid acceptance with our customers.”