Keysight Technologies introduced 3D Interconnect Designer, a software platform developed to support the design of complex interconnect structures in chiplet and three-dimensional integrated circuit (3DIC) packages used in AI infrastructure and data center applications. The tool addresses manual optimization challenges associated with multi-die and stacked-die designs, including vias, transmission lines, solder balls and micro-bumps. Supports advanced geometries such as hatched and waffled ground planes used in silicon interposers and bridge-based architectures. 3D Interconnect Designer validates designs against emerging standards including UCIe and BoW and incorporates electromagnetic-based simulation for electrical analysis of PCB and package-level 3D interconnect structures. Automated design cycles reduce manual workflow steps and support early compliance validation to mitigate late-stage design failures.

Keysight Technologies