Elephantech 15nm class copper nanofiller is said to be the smallest commercial-grade filler of its kind. Developed through proprietary synthesis methods. Delivers long-term dispersion stability, high conductivity and low resistivity. Enables low-temperature wet reduction processing at 60 °C. Materials offered in glycol ether solvents and adaptable to multiple formats, including inks and pastes. Target applications span PCB wiring, MLCC electrodes, solar cell electrodes, power semiconductor bonding and EMI shielding.

Average copper particle diameter is 15nm. Solid content is 55–85 wt%. Viscosity is 100–1,000Pa·s at 25 °C and specific gravity is 3.2–3.5g/cm³

Elephantech Inc.

www.elephantech.co.jp