Schmid Upgrades InfinityLine H+ Electroless Cu System
Schmid's InfinityLine H+ electroless copper system is designed for the production of high-performance advanced packaging applications using mSAP and SAP processes.
Is said to achieve highly uniform copper deposition and features enhancements such as an ozone module for pristine surface preparation, an advanced electroless copper module design and a three-point transport system that eliminates contact with active areas. Uses a horizontal process to treat each panel automatically under identical process conditions using efficient flood boxes that target treatment areas, enhancing the uniformity of copper thickness and provides superior performance in rinsing and drying substrate panels. Offers a smarter and more sustainable production solution through the use of the Schmid Watch 3.0 HMI and process control system, which leverages the decentralized H+ bus system for active and passive components.
Schmid
