Doosan's new high-end copper-clad layer lineup features products suitable for memory, system semiconductors, communications networks and smart devices.

CCL for semiconductor packaging electrically connects semiconductor chips and mainboards and protects semiconductors. Features rapid and accurate transmission of electrical signals and high strength to withstand high-temperature semiconductor processes.

CCL for communications networks is applied in data centers. Doosan Corp. will showcase 800 Gigabit Ethernet (GbE) CCL, which increases data processing speed and minimizes communications latency, and the next-generation 1,600 GbE CCL currently under development.

Flexible CCL is core material for flexible printed circuit boards that can bend flexibly and is mainly used in smartphones and tablet PCs. Has the durability to be folded and unfolded over a million times, making it suitable for the latest foldable phones.

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